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High-precision opto-mechanical lens system for space applications assembled by innovative local soldering technique

 
: Ribes, P.; Koechlin, C.; Burkhardt, T.; Hornaff, M.; Burkhardt, D.; Kamm, A.; Gramens, S.; Beckert, E.; Fiault, G.; Eberhardt, R.; Tünnermann, A.

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Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Integrated Optics: Devices, Materials, and Technologies XX : San Francisco, California, 15 - 17 February 2016
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 9750)
Art. 97501K
Conference "Integrated Optics - Devices, Materials, and Technologies" <20, 2016, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IOF ()

Abstract
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard taking as input specifications the requirements found for the optical beam expander for the European Space Agency (ESA) EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands; handling high mechanical and thermal loads without losing its optical performances. Finally a high-precision opto-mechanical lens mount has been assembled with a minimal localized stress (<1 MPa) showing outstanding performances in terms of wave-front error measurements and beam depolarization ratio before and after environmental tests.

: http://publica.fraunhofer.de/documents/N-422546.html