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Precision determination of thermoreflectance coefficients for localised thermometry

: Schlag, R.; Ras, M.A.; Arlt, V.; May, D.; Winkler, T.; Wunderle, B.


Components, Packaging and Manufacturing Technology Society -CPMT-:
21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015 : Paris, France, 30 September – 2 October 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4673-9705-6 (online)
ISBN: 978-1-4673-9706-3 (print on demand (Curran))
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <21, 2015, Paris>
Conference Paper
Fraunhofer ENAS ()

The continual trend of microelectronics to miniaturization, accompanied by the increase of the power density has given modern science a huge challenge. The thermal transport in an electronic device has to be addressed. Therefore, the fast and precise measurement of thermal properties like temperature, thermal conductivity and diffusivity is needed. Especially the spatial resolution needs to be enhanced since the thermal structure size lies within several nanometres nowadays. A contactless measurement device for the surface temperature is presented in this work for later use in a full frame measurement. It utilizes the thermoreflectance effect, which connects the reflectance of a surface with its temperature. A measurement setup has been built and the thermoreflectance coefficient of different metals has been measured. They are in accordance with the values for metals with e.g. 4,9E-5 for pure Si.