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Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials

 
: Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.

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Components, Packaging and Manufacturing Technology Society -CPMT-:
21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015 : Paris, France, 30 September – 2 October 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4673-9705-6 (online)
ISBN: 978-1-4673-9706-3 (print on demand (Curran))
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <21, 2015, Paris>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Within this paper, we present a guideline for the mechanical acceleration of reliability experiments for end-of-lifetime prognostics of metal based die attach materials. First, we used an advanced hybrid nano-effect sintered silver layer as interface between die and substrate which has very good electrical and thermal conductivities. Two pairs ofexperiment/simulation are scheduled. An isothermal mechanical 3-pt bending experiment to induce fatigue the specimens rapidly as well as a thermal induced strain fatigue by thermal chamber for validation. The manufactured specimens are designed to be used for both. With a FEM of this subsystem to simulate the failure parameter which is the accumulated von Mises strain, lifetime modelling can be performed.

: http://publica.fraunhofer.de/documents/N-422467.html