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Development of a microcamera with embedded image processor using panel level packaging

 
: Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D.

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
pp.271-274
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In the upcoming Internet of Things era there is a strong demand for smart miniaturized sensors, which can be integrated in all kinds of environments, from industry to medical. Microcameras with real time image processing can serve a wide range of applications like face or gesture recognition as well as traffic sign detection or lane departure warning. Today's microcameras consist of an optics module with lenses and image sensor, which is attached by a flex cable or connector to one or more PCB's with image processor and other required components. Drawback of this construction is limited reliability, relatively large size and high cost. This paper describes the development and realization of an extremely compact microcamera module using a highly efficient Panel Level Packaging (PLP) technology. Most components are embedded into a PCB of 16x16 mm2 size and 3.6 mm thickness with a weight of only 2 g.

: http://publica.fraunhofer.de/documents/N-422466.html