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Design, setup and test of a heterogeneous module and characterization by stress measurement

: Schreier-Alt, T.; Reitlinger, C.; Kaul, F.; Metzger, T.; Revenberg, K.

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
Conference Paper
Fraunhofer IZM ()

This paper presents design, setup and test of a heterogeneous antenna tuner module and its characterization by stress measurements. Key features provided for this integration platform are a small module size in combination with a low module height, a good RF performance, good heat dissipation capabilities, high electrical and thermo-mechanical reliability also supporting the low pressure encapsulation of MEMS cavity packages, a compatibility with a small pitch (150 mu m) of the devices to be assembled, and high cost efficiency. Based on multi-layer substrates, modules have been designed to develop a low pressure molding process (max. pressure of 30 bar) and to integrate a fine pitch flip chip technology (max. pitch of 150 mu m).