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Ultra-Thin high density capacitors for advanced packaging solutions

 
: Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W.

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
pp.24-28
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
English
Conference Paper
Fraunhofer IPMS ()
Fraunhofer IZM ()

Abstract
The growing demand on small system solutions is driving the compression of many functions into small package outline. This requires sophisticated solutions to avoid external circuitry area when integrating passive components. Moreover, decoupling capacitors need to be placed as close as possible to the active circuits in order to suppress cross-coupling between different power planes efficiently. In our paper we present the concept, fabrication and characterization results of ultra-Thin silicon capacitors that can be integrated into chip package or embedded in PCB. High capacitance densities are achieved by using high-k materials as dielectric supporting a broad application range from RF-filtering to decoupling and energy buffering. Based on characterization results of voltage and temperature characteristics it is shown that this concept offers good electrical properties and linearity compared to conventional ceramic capacitors, like MLCC.

: http://publica.fraunhofer.de/documents/N-422464.html