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Ultra-thin multi-aperture depth monitoring camera modules with megapixel resolution

: Bräuer, A.; Brückner, A.; Wippermann, F.; Oberdörster, A.


IEEE Photonics Society:
20th Microoptics Conference, MOC 2015 : Fukuoka, Japan 25 – 28 October 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-4-86348-543-3 (Electronic)
ISBN: 978-4-86348-487-0 (print)
ISBN: 978-1-4799-1729-7 (print on demand)
ISBN: 978-4-86348-486-3 (Electronic)
Microoptics Conference (MOC) <20, 2015, Fukuoka>
Conference Paper
Fraunhofer IOF ()

The slim design of portable electronic devices (e.g. smartphones) causes a constant need for miniaturized camera systems. This trend pushes the shrinking of opto-electronic, electronic and optical components. While opto- and micro-electronics have made tremendous progress, the technology for the miniaturization of optics still struggles to keep up. The demand for a higher image resolution and large aperture of the lens (both driven by shrinking pixel size) conflict with the need for a short focal length and a simple, compact design. These conditions impose high demands on the fabrication technology, especially when considering that it has to meet one-hundreds of a percent relative accuracy. Wafer-level optics (WLO) fabrication for camera lenses is a promising candidate, enabling high-volume production with low cost. However, the resolution that is currently available with WLO-technology is limited due to material and process control issues.