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Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques

 
: Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.

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Institute of Electrical and Electronics Engineers -IEEE-:
17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 : Montpellier, 18-20 April 2016
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-2106-2
5 pp.
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <17, 2016, Montpellier>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molecular dynamics simulations. By variation of crosslink density, one supposed effect of ageing (post-curing) is investigated with respect to its impact on diffusivity of water molecules and the free volume of the epoxy matrix. In a simple submodel of a composite material, the portability of the results into FE simulations and their validity are discussed by comparison to experimental results.

: http://publica.fraunhofer.de/documents/N-422353.html