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Thermal design of integrated heating for lab-on-a-chip systems

 
: Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T.

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Institute of Electrical and Electronics Engineers -IEEE-:
17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 : Montpellier, 18-20 April 2016
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-2106-2
pp.98-103
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <17, 2016, Montpellier>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
The transient thermal behavior of heating in a Lab-on-a-Chip (LoC) system is important for biological processes that require temperature treatment. A technology platform for LoCs that provides integrated heating functionality has been previously described. For a better understanding of the underlying mechanisms of its thermal dynamics a test system has been set up consisting of a printed circuit board, adhesive tape, integrated heater and microfluidic substrate. The focus of this contribution is the modelling of a transient thermal behavior model of non-integrated and integrated nonlinear heater and its experimental validation. A thermal model of a heating element in a polymer-based system's environment is developed with Finite Element Method. The thermal performance of both, integrated and non-integrated heating elements, is compared. The resulting design considerations are described in detail.

: http://publica.fraunhofer.de/documents/N-422350.html