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Hier finden Sie wissenschaftliche Publikationen aus den FraunhoferInstituten. On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
 Institute of Electrical and Electronics Engineers IEEE; IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 20th Workshop on Signal and Power Integrity, SPI 2016. Proceedings : 811 May, 2016, Starhotel Majestic, Turin, Italy Piscataway, NJ: IEEE, 2016 ISBN: 9781509003495 ISBN: 9781509003488 ISBN: 9781509003501 pp.120123 
 Workshop on Signal and Power Integrity (SPI) <20, 2016, Turin> 

 English 
 Conference Paper 
 Fraunhofer IZM () 
Abstract
Large via arrays contribute substantially to the coupling path of crosstalk between channels of interconnects. In principle, in order to design robust interconnects, the crosstalk contributions from all aggressor channels must be quantified and adequately superposed to represent the crosstalk mechanism. If the modeling is based on frequency domain electromagnetic simulations, in general, it is necessary to simulate the complete geometry for a large number of frequencies in order to accurately represent the physical effects. In this paper, an efficient statistical frequency domain superposition of crosstalk is proposed and validated against time domain methods. The proposed approach provides a measure of total crosstalk by assuming uncorrelated signals on different channels. Using this definition, it can be reasoned whether an upper bound of total uncorrelated crosstalk exists and which vias should be included in a meaningful approximation of a large array.