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Model-based adhesive shrinkage compensation for increased bonding repeatability

 
: Müller, T.; Schlette, C.; Lakshmanan, S.; Haag, S.; Zontar, D.; Sauer, S.; Wenzel, C.; Brecher, C.; Roßmann, J.

:

Glebov, A.L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Components and Packaging for Laser Systems II. Proceedings : 16-17 February 2016, San Francisco, California, United States
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 9730)
ISBN: 978-1-62841-965-8
Paper 97300S
Conference "Components and Packaging for Laser Systems" <2, 2016, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IPT ()

Abstract
The assembly process of optical components consists of two phases-the alignment and the bonding phase. Precision-or better process repeatability-is limited by the latter one. The limitation of the alignment precision is given by the measurement equipment and the manipulation technology applied. Today's micromanipulators in combination with beam imaging setups allow for an alignment in the range of far below 100nm. However, once precisely aligned optics need to be fixed in their position. State of the art in optics bonding for laser systems is adhesive bonding with UV-curing adhesives. Adhesive bonding is a multi-factorial process and thus subject to statistical process deviations. As a matter of fact, UV-curing adhesives inherit shrinkage effects during their curing process, making offsets for shrinkage compensation mandatory. Enhancing the process control of the adhesive bonding process is the major goal of the activities described in this paper.

: http://publica.fraunhofer.de/documents/N-422255.html