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Processing-structure-property correlations of sintered silver

 
: Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings : May 31 - June 03, 2016, Las Vegas, Nevada, USA
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-4799-5266-3
ISBN: 978-1-4673-8121-5
ISBN: 978-1-4673-8120-8
ISBN: 978-1-4673-8122-2
pp.1064-1071
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <15, 2016, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper presents a systematic study of sintered silver. In order to investigate the correlation between processing conditions, microstructures, thermal and electrical properties, sintered silver samples have been prepared in 27 variations of sintering temperature between 200°C and 270°C and sintering pressure between 5 MPa and 25 MPa. For the thermal and electrical characterization, the innovative test stand LaTIMA has been used. The microstructures of the samples have been analyzed by focused ion beam (FIB) and scanning electron microscope (SEM). The results of the thermal and electrical characterizations as well as the structure analysis showed clear correlation to the process conditions of sintered silver.

: http://publica.fraunhofer.de/documents/N-422217.html