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Inline monitoring of epoxy molding compound in transfer molding process for smart power modules

 
: Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings : 31 May-3 June 2016, Las Vegas, Nevada, USA
Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016
ISBN: 978-1-5090-1205-3 (Print)
ISBN: 978-1-5090-1204-6 (Online)
ISBN: 978-1-5090-1203-9
pp.714-721
Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The quality of smart power modules strongly depends on the material characteristics of epoxy molding compound (EMC) and transfer molding process parameters. In order to predict the quality and to diminish the failure mechanisms, inline monitoring techniques in transfer molding process are essential. This work examines the inline identification of the variations in the EMC characteristics in the transfer molding process. Dielectric Analysis (DEA) is chosen as an inline technique and the influence of prolonged storage duration, moisture content and batch-To-batch variation on the characteristics of EMC are studied. In addition, the impact of molding temperature on the cure behavior of the EMC is in-situ examined. DEA results are verified and compared with the rheological and calorimetric analysis and good correlation is established.

: http://publica.fraunhofer.de/documents/N-422144.html