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2015
Conference Paper
Titel
Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Abstract
A newly developed 3D microcontroller system with a radio interface based on a silicon interposer with silicon cover is investigated with respect to the reliability of its interconnect to the substrate. Finite element (FE) simulations are performed in order to determine the influence of different technology parameters such as standoff height, underfill and the use of additional solder balls.