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Improving the lifetime of a 3D radio frequency transceiver by finite element simulations

 
: Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.

Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2015 : 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015
Aachen: Apprimus-Verlag, 2015
ISBN: 978-3-86359-296-7
pp.469-472
Smart Systems Integration Conference (SSI) <2015, Copenhagen>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <9, 2015, Copenhagen>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A newly developed 3D microcontroller system with a radio interface based on a silicon interposer with silicon cover is investigated with respect to the reliability of its interconnect to the substrate. Finite element (FE) simulations are performed in order to determine the influence of different technology parameters such as standoff height, underfill and the use of additional solder balls.

: http://publica.fraunhofer.de/documents/N-418271.html