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3D integration of a membrane thermoelectric sensor array for space debris detection

: Mohaupt, M.; Hänschke, F.

Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2015 : 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015
Aachen: Apprimus-Verlag, 2015
ISBN: 978-3-86359-296-7
Smart Systems Integration Conference (SSI) <2015, Copenhagen>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <9, 2015, Copenhagen>
Conference Paper
Fraunhofer IOF ()

A new type of thermoelectric sensor was developed for measuring the impact energy of space debris [1]. The new sensor concept enables the detection of particles of 2-10 µm size as well as their mass, velocity, and trajectory. The 3-dimensional integration process for realizing prototypes of the sensor units is described, the development of the 3-D-integration process is illustrated, and the requirements to processes and materials for space application developments are shown. The mechanical design of the sensor, the MEMS-based thermoelectric sensor membrane design as well as the chosen alignment and fixation technologies are presented. Details of the 3-D-integration of the sensor modules are given by discussing the overlay accuracy results. The integration process is visualized by presenting handling devices and process adaptions and finally, process optimization offers new perspectives for a high volume sensor production.