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Innovative failure analysis techniques for 3-D packaging developments

: Altmann, F.; Petzold, M.


IEEE design & test 33 (2016), No.3, pp.46-55
ISSN: 2168-2356
ISSN: 0740-7475
Bundesministerium für Bildung und Forschung BMBF
13N10972; ENIAC
Journal Article
Fraunhofer IMWS ()

Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging techniques challenge the conventional PFA techniques and require new approaches. This article provides an overview of recent results in this domain achieved at Fraunhofer IWM.