Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages

: Kaya, Burcu; Kaiser, Jan-Martin; Becker, Karl-Friedrich; Braun, Tanja; Lang, Klaus-Dieter

International Microelectronics and Packaging Society -IMAPS-; Institute of Electrical and Electronics Engineers -IEEE-:
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-0-9568086-1-5
ISBN: 978-0-9568086-2-2
6 pp.
European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>
Conference Paper
Fraunhofer IZM ()

The quality of molded electronic packages is strongly influenced by material characteristics of epoxy molding compound (EMC) and transfer molding process parameters. This work comprises the understanding of the effects of individual process parameters on the failure mechanisms and evaluation the suitability of the online cure monitoring technique to observe the variations in material characteristic for transfer molding process. Molding temperature, preheat time, holding pressure as well as transfer speed are selected as process parameters. The effect of these process parameters on void formation and wire sweep is analyzed. Dielectric Analysis (DEA) is chosen as an in-situ technique and the suitability of the DEA is assessed for monitoring the cure behavior of the EMC regarding different variables. The effect of cure temperature, storage duration, moisture and the material batch differences on the dielectric signal are studied and the variations on the ion viscosity and the cure behavior of EMC are discussed.