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Embedded life-cycle information module for monitoring and identification of product use conditions

 
: Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-:
EcoDesign '03, 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing : December 8 - 11, 2003, Tokyo, Japan
Piscataway, NJ: IEEE Operations Center, 2003
ISBN: 0-7803-8590-X
pp.733-740
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <3, 2003, Tokyo>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Further, it could improve design, market research and quality management. This paper describes modular concepts for life-cycle monitoring, identification of use conditions, reliability assessment and diagnosis. MEMS-based prototypes are discussed, which measure, identify, and record data strongly correlated with the degradation of a product during its use phase. They are designed to get embedded in various products. The product's remaining life can be estimated during its use by dedicated algorithms implemented in the data processing unit. The recorded data can be retrieved either during the use stage or after product takeback.

: http://publica.fraunhofer.de/documents/N-39487.html