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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Chip-to-wafer stacking technology for 3D system integration

 
: Klumpp, A.; Merkel, R.; Wieland, R.; Ramm, P.

:

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
53rd Electronic Components & Technology Conference 2003. Proceedings : New Orleans, Louisiana, USA, May 27 - 30, 2003
Piscataway, NJ: IEEE Service Center, 2003
ISBN: 0-7803-7791-5
pp.1080-1083
Electronic Components and Technology Conference (ECTC) <53, 2003, New Orleans/La.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-39477.html