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Electrical characterisation of a power SO-package in the context of electrostatic discharge

: Dörr, I.; Gieser, H.A.; Sommer, G.; Wolf, H.; Wilkening, W.; Willemen, J.; Andreini, A.; Salhi, F.; Fotheringham, G.; John, W.; Reichl, H.


IEEE Electromagnetic Compatibility Society; International Union of Radio Science -URSI-, Commission Electronics and Photonics:
IEEE International Symposium on Electromagnetic Compatibility, EMC 2003. Symposium record. Vol.1 : 11 - 16 May 2003, Istanbul, Turkey
Piscataway, NJ: IEEE Service Center, 2003
ISBN: 0-7803-7779-6
International Symposium on Electromagnetic Compatibility (EMC) <2003, Istanbul>
Conference Paper
Fraunhofer IZM ()

The electrostatic discharge (ESD) sensitivity of integrated circuits with respect to the charged device model depends strongly on the package. Electrical characteristics of a package are, if at all extracted, application specific. They depend on the environment e.g. the PCB. This paper characterises the package for the 1st time taking into account the CDM tester environment. The extracted parameters are a prerequisite for circuit simulation of integrated circuits under CDM-stress.