Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches

 
: Auersperg, J.; Vogel, D.; Michel, B.

:

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Thermal and mechanical simulation and experiments in microelectronics and microsystems. EuroSimE 2004 : Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, May 10 - 12, 2004, Novotel Tour Noire, Brussels, Belgium
Piscataway, NJ: IEEE, 2004
ISBN: 0-7803-8420-2
ISBN: 0-7803-8421-0
pp.169-174
International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <5, 2004, Brüssel>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Enhanced miniaturization and system integration of microelectronics components demands growth in novel solutions toward embedding active and passive components into substrates, clothes, protective sleeves of consumer goods - smart, thin applications in general. As a result, the embedding of very thin silicon dies and metallic structures into highly flexible polymeric, paper like or textile materials causes several mechanical problems preventing those applications from being utilized. This paper intends to demonstrate and discuss advantages and needs of using fully parameterized finite element modeling techniques for design optimizations of thin devices on the basis of damage evaluation and fracture mechanics approaches. For improving that method, the evaluation of mixed mode interface delamination phenomena and fracture of embedded thin silicon were combined with experimental investigations.

: http://publica.fraunhofer.de/documents/N-38354.html