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In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering

 
: Scholz, O.; Eisenbarth, M.; Hanke, R.; Bigl, T.; Schmitt, P.

Meyendorf, N. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; National Institute of Standards and Technology -NIST-:
Testing, reliability, and application of micro- and nano-material systems : 3 - 5 March 2003, San Diego, California, USA
Bellingham/Wash.: SPIE, 2003 (SPIE Proceedings Series 5045)
ISBN: 0-8194-4850-8
pp.147-156
Conference "Testing, Reliability, and Application of Micro- and Nano-Material Systems" <2003, San Diego/Calif.>
English
Conference Paper
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

: http://publica.fraunhofer.de/documents/N-38333.html