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A geometry-independent lifetime modelling method for aluminum heavy wire bond joints

 
: Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 : 19-22 April 2015, Budapest, Hungary
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-9949-1 (Print)
ISBN: 978-1-4799-9950-7
ISBN: 978-1-4799-9951-4
pp.99-104
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Wire bond degradation is a limiting factor for the lifetime of state of the art power modules. So, there is a need for widely applicable and proven modelling techniques to achieve a reliable design. In this paper, a new crack growth law has been developed and calibrated with experimental data. By defining a failure criterion and optimizing model parameters, good lifetime predictions have been achieved. In addition, further possibilities to use this modelling approach have been proposed, e.g. damage in interconnect layers as sinter silver or solder layers could be considered.

: http://publica.fraunhofer.de/documents/N-383282.html