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Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

 
: Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.2 : San Diego, California, USA, 26 - 29 May 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-8610-1
ISBN: 978-1-4799-8609-5
pp.1343-1350
Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The paper presents different approaches for hermetic wafer level packaging of oscillator components like quartz crystals or silicon resonators. The proposed concepts involve technologies like TSV formation into passive or active silicon wafers, formation of proper bond frames on interposer, ASIC or cap wafers as well as hermetic bonding using AuSn soldering either in wafer to wafer style or with reconfigured components on a carrier wafer.

: http://publica.fraunhofer.de/documents/N-383227.html