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3D system integration technologies

 
: Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.

McKerrow, A.J.:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : Symposium held April 21 - 25, 2003, San Francisco, California, U.S.A. ; [Symposium E, held at the 2003 MRS spring meeting
Warrendale, Pa.: Materials Research Society, 2003 (Materials Research Society Symposium Proceedings 766)
ISBN: 1-558-99703-2
pp.3-14
Symposium E: "Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics" <2003, San Francisco/Calif.>
Materials Research Society (Spring Meeting) <2003, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38322.html