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Fabrication of polycrystalline diamond on a flexible Parylene substrate

 
: Fan, Bin; Rechenberg, R.; Becker, M.F.; Li, Wen

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 : 21-25 June 2015, Anchorage, Alaska, USA
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-8955-3
ISBN: 978-1-4799-8954-6
pp.892-895
International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) <18, 2015, Anchorage/Alaska>
English
Conference Paper
Fraunhofer CCD ()

Abstract
This paper reports a novel fabrication process of transferring polycrystalline diamond (PCD) from a 3-inch silicon wafer onto a flexible Parylene-C substrate. Combining Parylene-C with PCD can improve the mechanical flexibility while preserving the benefits of PCD (biocompatibility, chemical inertness, high thermal conductivity and feasibility of being selectively doped to be a semiconductor or insulator). This fabrication process breaks the barrier that PCD cannot grow on flexible polymeric substrate due to high temperature processes (500-900°C), which exceeds the melting point of most flexible polymers. As a demonstration of the technique, we transferred boron-doped polycrystalline diamond (BDD) on a Parylene-C substrate and assembled muLEDs on BDD for a potential application in optogenetics. Electrical and optical characteristics of a fabricated device were investigated and discussed in the paper.

: http://publica.fraunhofer.de/documents/N-383197.html