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Active power cycling results using copper tin TLPB joints as new die-attach technology

 
: Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe 2015. CD-ROM : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings
Berlin: VDE Verlag, 2015
ISBN: 978-3-8007-3924-0
pp.1268-1275
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A new highly reliable die-attach technology for high operating temperature is called Transient Liquid Phase Bonding (TLPB). The TLPB is based on phase transformation into intermetallic phases using a low melting solder layer and a high melting bonding surface. Due to this fact the re-melting temperature of such a transformed joint increased up to the decomposition temperature of the intermetallic phase, which might be more the 200 K of the used soldering temperature. In active power cycling analysis between +30 degC and 180 degC (DeltaT = 150 K) the TLPB showed more than 100-times longer lifetime compared to eutectic SnAg-solder. Furthermore, other failure mechanisms were found compared to Sn-based solder joints such as fatigue cracks in the copper layers of the DCB-substrate and the chip interface as well as delamination between the AI203-layer and the bottom Cu-layer of the DCB.

: http://publica.fraunhofer.de/documents/N-383117.html