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Chip in polymer: 3D integration of active circuitry in polymeric substrate
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2003
Conference Paper
Titel
Chip in polymer: 3D integration of active circuitry in polymeric substrate
Author(s)
Jung, E.
Wojakowski, D.
Neumann, A.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Advances in electronic packaging 2003. Vol.1
Konferenz
International Electronic Packaging Technical Conference and Exhibition 2002
DOI
10.1115/IPACK2003-35025
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM