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Flip chip technology for high temperature automotive applications

 
: Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2003. Proceedings : November 18 - 20, 2003, Hynes Convention Center, Boston, MA
Washington, DC: IMAPS, 2003 (SPIE Proceedings Series 5288)
ISBN: 0-930815-71-8
ISBN: 0-8194-5189-4
pp.853-858
International Symposium on Microelectronics <36, 2003, Boston/Mass.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38253.html