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Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

: Santos, R.; D'Agostino, D.; Soares, F.M.; Haghighi, H.R.; Williams, K.A.; Leijtens, X.J.M.


IEEE Photonics Technology Letters 28 (2016), No.3, pp.245-247
ISSN: 1041-1135
Journal Article
Fraunhofer HHI ()

In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.