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Simulation based analysis of LED package reliability regarding encapsulant related failures

: Watzke, Stefan


Stuttgart: Fraunhofer Verlag, 2016, xxv, 137 pp.
Zugl.: Berlin, TU, Diss., 2015
ISBN: 978-3-8396-0956-9
Fraunhofer IZM ()

Within the work several LED encapsulation material related reliability issues are investigated by means of finite element analysis (FEM). The typically used silicone and epoxy materials are mechanically characterized after subjecting them to different environmental conditions. Based on these investigations material models for the FEM are created. Finally, the material models are used to simulate some encapsulation related reliability issues.