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Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

 
: Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G.

:

Morris, J.E. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Advanced Packaging Materials 2001. Proceedings : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 11 - 14, 2001
Washington, DC: IMAPS, 2001
ISBN: 0-930815-64-5
pp.129-134
International Symposium on Advanced Packaging Materials <7, 2001, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38139.html