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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Lead free alloys for flip chip bumping
| Morris, J.E. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Advanced Packaging Materials 2001. Proceedings : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 11 - 14, 2001
Washington, DC: IMAPS, 2001
ISBN: 0-930815-64-5
pp.119-122 |
| International Symposium on Advanced Packaging Materials <7, 2001, Braselton/Ga.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |