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  4. Lead free alloys for flip chip bumping
 
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2001
Conference Paper
Title

Lead free alloys for flip chip bumping

Author(s)
Jung, E.
Aschenbrenner, R.
Kallmayer, C.
Coskina, P.
Reichl, H.
Mainwork
International Symposium on Advanced Packaging Materials 2001. Proceedings  
Conference
International Symposium on Advanced Packaging Materials 2001  
DOI
10.1109/ISAOM.2001.916560
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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