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Lead free alloys for flip chip bumping

 
: Jung, E.; Aschenbrenner, R.; Kallmayer, C.; Coskina, P.; Reichl, H.

:

Morris, J.E. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Advanced Packaging Materials 2001. Proceedings : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 11 - 14, 2001
Washington, DC: IMAPS, 2001
ISBN: 0-930815-64-5
pp.119-122
International Symposium on Advanced Packaging Materials <7, 2001, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38110.html