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Lead free alloys for flip chip bumping
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2001
Conference Paper
Title
Lead free alloys for flip chip bumping
Author(s)
Jung, E.
Aschenbrenner, R.
Kallmayer, C.
Coskina, P.
Reichl, H.
Mainwork
International Symposium on Advanced Packaging Materials 2001. Proceedings
Conference
International Symposium on Advanced Packaging Materials 2001
DOI
10.1109/ISAOM.2001.916560
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM