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High density pixel detector module using flip chip and thin film technology

 
: Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
HD International Conference on High-Density Interconnect and Systems Packaging 2000. Proceedings : 25 - 28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA
Reston, Va.: IMAPS, 2000 (SPIE Proceedings Series 4217)
ISBN: 0-930815-60-2
pp.553-556
International Conference on High-Density Interconnect and Systems Packaging <2000, Denver/Colo.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm x 60.4mm, 16 read out ICs, each serving 24x160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dice are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

: http://publica.fraunhofer.de/documents/N-38072.html