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Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages

 
: Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 2000. Proceedings : September 20 - 22, 2000, Hynes Convention Center, Boston, Massachusetts
Reston, Va.: IMAPS, 2000 (SPIE Proceedings Series 4339)
ISBN: 0-930815-62-9
pp.208-211
International Symposium on Microelectronics <2000, Boston/Mass.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A planar integration technology of ultra-thin bare dice in a Wafer-Level Thin-Film technology to yield a high-dense module is presented here. This Thin Chip Integration (TCI) technology consists of one or more ultra-thin chips which are stacked on a larger sized standard thick chip and which are interconnected by a thin film routing. The dice are glued on a carrier chip on wafer-level. A standard thin film multilayer which was developed for a redistribution process is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W / Cu tie layer, which is subsequently electroplated. Cyclotene 4000 is used as interlevel low k dielectric. This unique module concept can lead to new applications that would be not feasible before. It will lead the packaging world to new 3D packages.

: http://publica.fraunhofer.de/documents/N-38056.html