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Reliability investigations of FCOB assemblies with process-induced defects

 
: Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.

:

Wong, C.P. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Advanced Packaging Materials - Processes, Properties and Interfaces 2000. Proceedings : Chateau Elan, Braselton, Georgia, March 6 - 8, 2000
Reston, Va.: IMAPS, 2000
ISBN: 0-930815-59-9
pp.50-57
International Symposium on Advanced Packaging Materials <2000, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38041.html