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Evaluation of flip chip bonding using ACA on polyester substrates

 
: Mießner, R.; Nieland, C.; Aschenbrenner, R.; Reichl, H.

Kivilahti, J.; Hyytiaeinen, M. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Adhesives in Electronics 2000. 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing : Espoo, Finland, June 18 - 21, 2000
New York, NY: IEEE, 2000
ISBN: 0-7803-6460-0
pp.46-51
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing <4, 2000, Helsinki>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-38010.html