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Lead free solders for area array packaging

 
: Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 2000. Proceedings : September 20 - 22, 2000, Hynes Convention Center, Boston, Massachusetts
Reston, Va.: IMAPS, 2000 (SPIE Proceedings Series 4339)
ISBN: 0-930815-62-9
pp.551-557
International Symposium on Microelectronics <2000, Boston/Mass.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-37982.html