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Simulation for fatigue, cracks and delamination

 
: Dudek, R.; Auersperg, J.; Michel, B.

Zhang, G.Q.:
Benefiting from thermal and mechanical simulation in micro-electronics : Papers from the the first international conference; held at Eindhoven, The Netherlands, March 23 - 24, EuroSimE2000
Boston: Kluwer Academic Publishers, 2000
ISBN: 0-7923-7278-6
pp.93-111
International Conference on Benefiting from Thermal and Mechanical Simulation in Micro-Electronics (EuroSimE) <1, 2000, Eindhoven>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-37957.html