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2000
Journal Article
Titel
Residual stress studies in graded W/Cu materials by neutron diffraction method
Abstract
The combination of high thermal and electrical conductivity of copper with thermal resistance of tungsten is of great interest for industry. The different heat expansion coefficients, however, pose a serious problem to the coexistence of the two phases. The possible solution can be found in creating a composition gradient between the two metals. The aims of the present work were to investigate the residual stress states in various W/Cu gradient materials and to compare the experimental results with model simulations.