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Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres

 
: Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H.

Kutilainen, J. ; International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter:
IMAPS Nordic Annual Conference 2015 : Helsingor, Denmark, 8 - 9 June 2015
Red Hook, NY: Curran, 2015
ISBN: 978-1-5108-0813-3
pp.156-163
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) <2015, Helsingor>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-375021.html