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High-voltage monolithic 3D capacitors based on through-silicon-via technology

Poster presented at IITC-MAM 2015, IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, 18-21 May 2015, Grenoble
 
: Grünler, Saeideh; Rattmann, Gudrun; Erlbacher, Tobias; Bauer, Anton; Frey, Lothar

:
Poster urn:nbn:de:0011-n-3748492 (1.4 MByte PDF)
MD5 Fingerprint: 24c9ec70d1452021bea36d5f49e05184
Created on: 26.1.2016


2015, 1 Folie
International Interconnect Technology Conference (IITC) <2015, Grenoble>
Materials for Advanced Metallization Conference (MAM) <2015, Grenoble>
European Commission EC
FP7; 619246; ATHENIS 3D
English
Poster, Electronic Publication
Fraunhofer IISB ()

: http://publica.fraunhofer.de/documents/N-374849.html