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Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices

 
: Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 : 18-21 May 2015, Grenoble
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4673-7356-2
pp.233-236
International Interconnect Technology Conference (IITC) <2015, Grenoble>
Materials for Advanced Metallization Conference (MAM) <2015, Grenoble>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Thick electroplated Cu bond pads have lately been demonstrated to enable heavy Cu wire-bonding but the Cu oxides necessitate an additional cleaning step after the die-attach. To avoid such cleaning, the use of a thin Al layer is tested for its passivating ability on Cu bond pads and its suitability for the bonding process. Results show a significant improvement of the oxidation resistance and bonding performance.

: http://publica.fraunhofer.de/documents/N-374733.html