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Foreword special-issue on mems/nems packaging
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2003
Journal Article
Titel
Foreword special-issue on mems/nems packaging
Author(s)
Lee, Y.C.
Chiou, J.A.
Chen, S.C.
Jung, E.
Zeitschrift
IEEE transactions on advanced packaging
DOI
10.1109/TADVP.2003.817823
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM