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3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages

 
: Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.

12th Annual International Wafer-Level Packaging Conference, IWLPC 2015 : Interconnecting WLP, MEMS & 2.5/3D Integration. San Jose, California, USA 12 - 14 October 2015
Red Hook, NY: Curran, 2015
ISBN: 978-1-5108-3303-6
pp.89ff
International Wafer-Level Packaging Conference (IWLPC) <12, 2015, San Jose/Calif.>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-372265.html