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3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
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2015
Conference Paper
Titel
3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Author(s)
Hofmann, Lutz
Reuter, Danny
Schubert, I.
Wünsch, Dirk
Rennau, Michael
Ecke, Ramona
Vogel, Klaus
Gottfried, Knut
Schulz, Stefan E.
Geßner, Thomas
Hauptwerk
12th Annual International Wafer-Level Packaging Conference, IWLPC 2015
Konferenz
International Wafer-Level Packaging Conference (IWLPC) 2015
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS