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  4. Assembly and packaging of micro systems by using reactive bonding processes
 
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2015
Conference Paper
Title

Assembly and packaging of micro systems by using reactive bonding processes

Abstract
In this work, the process technology for fabricating reactive multilayer systems (RMS) has been developed, and the application of reactive bonding on the assembly of micro systems has been demonstrated. RMS have been fabricated by physical vapor deposition and have been provided as foils as well as direct coatings on the bond partners. Alternatively, RMS coatings by electroplating have been demonstrated. Besides the already established Al/Ni-RMS, new reactive materials as Zr/Al/Si, Pd/Sn and Pd/Al have been evaluated for the bonding process. For structuring the RMS chemical etching, lift-off-techniques, and laser structuring have been used on chip-scale as well as on wafer level up to 8 inches. As application examples, where the high thermal conductivity of reactive bonds is very useful, the mounting of Peltier coolers could be demonstrated. Furthermore, silicon-based acceleration sensors showed low mechanical stress after reactive bonding on ceramic substrates.
Author(s)
Schumacher, Axel
Hahn-Schickard
Gaiß, Ulrike
Hahn-Schickard
Knappmann, Stefan
Hahn-Schickard
Dietrich, Georg  
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
Braun, Stefan
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
Pflug, Erik  
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
Roscher, Frank  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Vogel, Klaus  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Hertel, Silvia
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Kähler, Dirk  
Fraunhofer-Institut für Siliziumtechnologie ISIT  
Reinert, Wolfgang  
Fraunhofer-Institut für Siliziumtechnologie ISIT  
Mainwork
20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015  
Conference
European Microelectronics and Packaging Conference & Exhibition (EMPC) 2015  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Fraunhofer-Institut für Siliziumtechnologie ISIT  
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
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