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Silicon photonics packaging on board-level

 
: Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Photonics Society:
28th IEEE Photonics Conference, IPC 2015 : Reston, Virginia, USA, 4 - 8 October 2015
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-7465-8
ISBN: 978-1-4799-7466-5
pp.474-475
International Photonics Conference (IPC) <28, 2015, Reston/Va.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The ongoing development focuses on low-loss single-mode glass waveguide panel integration in multi-layer electro-optical circuit boards (EOCB) and optical interconnection by micro-optics to the grating couplers of such assembled silicon photonic chips.

: http://publica.fraunhofer.de/documents/N-370664.html