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Micro welding of aluminum for post process electrode gap reduction using femtosecond laser

 
: Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 : 21-25 June 2015, Anchorage, Alaska, USA
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-8955-3
ISBN: 978-1-4799-8954-6
pp.1354-1357
International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) <18, 2015, Anchorage/Alaska>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper presents a new technology, which allows the reduction of the micro dimensional trench width below the technological limitations of the Deep Reactive Ion Etching (DRIE) process. The high-accuracy and high-throughput femtosecond laser-micro-welding of aluminum was performed for the first time by Micro Electrical Mechanical System (MEMS) fabrication to realize this permanent trench width reduction. Therefore, this technology has been applied for the electrode gap reduction of high precision vibration sensors, based on the capacitive working principle, resulting in a fourfold improvement of the sensitivity without changing the size of the sensor chip itself.

: http://publica.fraunhofer.de/documents/N-367217.html