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Evaluation of screen-printed metallization concepts for large-area BC-BJ solar cells

 
: Hendrichs, M.; Padilla, M.; Walter, J.; Clement, F.; Fell, A.; Rech, B.

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Fulltext urn:nbn:de:0011-n-3668618 (871 KByte PDF)
MD5 Fingerprint: 9024d240e46975453d9ada2f6e97b5da
Created on: 28.11.2015


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Photonics Society:
IEEE 42nd Photovoltaic Specialist Conference, PVSC 2015 : 14-19 June 2015, New Orleans, LA
Piscataway, NJ: IEEE, 2015
ISBN: 978-1-4799-7944-8
6 pp.
Photovoltaic Specialists Conference (PVSC) <42, 2015, New Orleans/La.>
English
Conference Paper, Electronic Publication
Fraunhofer ISE ()
PV Produktionstechnologie und Qualitätssicherung; Silicium-Photovoltaik; Pilotherstellung von industrienahen Solarzellen; back-contact; metallization; integration; printing

Abstract
In this study, we investigate a wire-based interconnection approach for back-contact back-junction (BC-BJ) solar cells with an edge length of 156 mm and screen-printed contact finger metallization. Every second contact finger is interrupted periodically, hence allowing for connecting contact fingers of each single polarity by wires without an additional insulation layer. By means of numerical simulations using the software Quokka, we show that contact finger interruptions up to 1 mm have no significant negative impact on the cell performance (Δ <; 0.1 %abs). Furthermore, adhesion tests of soldered cell interconnectors are carried out for different metallization concepts, aiming at finding suitable solder pad dimensions for 156 mm BC-BJ solar cells. Peel forces exceeding 1 N/mm are found for both investigated metallization concepts with i) screen-printed copper-based busbars with screen-printed insulation layer beneath, and ii) wire-based busbars without insulation layer.

: http://publica.fraunhofer.de/documents/N-366861.html