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Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

 
: Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2002. Proceedings : September 4 - 6, 2002, Colorado Convention Center, Denver, CO
Washington, DC: IMAPS, 2002 (SPIE Proceedings Series 4931)
ISBN: 0-930815-66-1
pp.727-732
International Symposium on Microelectronics <35, 2002, Denver/Colo.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-36158.html